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Researchers Create New Thermal Material




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  #1  
Old 15th Apr 2009, 12:19
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Found this article that "Sparkle have recently announced that it had successfully tested coolers using a diamond/carbon compound with researchers in Germany claiming to have achieved decent cooling results by adding diamond powder to copper".
It seems that using diamond powder fused with copper and crome to bind it, conducts the heat at a better rate than just copper but also doesnt expand and contract as much so lessening the possible wear and tear on the cpu,

Im interested to see if this will be developed further and if it will ever come onto the market or whether another company will follow thier lead, but dont think it will ever get the same results as water cooling but its early days yet so who knows,

http://www.custompc.co.uk/news/60555...-material.html
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  #2  
Old 15th Apr 2009, 14:08
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Quote:
Originally Posted by redden137 View Post
dont think it will ever get the same results as water cooling but its early days yet so who knows,
Could always use the compound to join the CPU to the waterblock, for the ultimate cooling
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  #3  
Old 15th Apr 2009, 14:42
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expensive...
  #4  
Old 15th Apr 2009, 18:55
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Note that this isn't a thermal compound, it's a coating to add to copper components.
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  #5  
Old 16th Apr 2009, 07:55
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Yes but with development.. who knows..
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